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The most obvious temperature change is in the DBC ceramic layer; only the 0.38 mm thick ceramic layer has a temperature change as high as 14 °C, which is because of the low thermal conductivity of the ceramic layer. In addition to using water-cooled heatsinks instead of air-cooled heatsinks, materials with higher thermal conductivity can also be selected to increase the heat transfer capacity. The thermal conductivity is manifested in the slope of temperature change in the figure. For example, for this paper, nano-silver solder (thermal conductivity of 240 W·m −1 ·K −1 ) was selected as the chip solder layer to replace the traditional SAC305 (thermal conductivity of 32.7 W·m −1 ·K −1 ). In addition, for the DBC ceramic layer, AlN (thermal conductivity of 319 W·m −1 ·K −1 ) was also be used to replace the original Al 2 O 3 (thermal conductivity of 25 W·m −1 ·K −1 ). The cost of high-thermal-conductivity materials is relatively high, and the industry needs to balance cost and performance according to actual needs. The water-cooled heatsink mainly realizes the heat dissipation of high-power electronic devices through convective heat transfer. The heat transfer area and shape of the heat exchange surface, as well as the fluid medium and flow conditions, are the main factors that affect convective heat transfer. Therefore, at the same flow rate, the junction temperature of the optimized IGBT model is lower than before optimization. Transportes futura.Ultimos artigos.
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